500-607 Electronics-grade Alkoxy Silicone (2-part sealant)

500-607 Electronics-grade Alkoxy Silicone (2-part sealant)

500-607 is a soft, very low viscosity clear pottant that flows easily into intricate architectures and complex designs, with low shrinkage and long working times. As one of our 500 Series Electronics-grade silicones, 500-607 is a neutral cure (alkoxy) deep section pottant with long working times and unlimited cure depth. Ideal for applications with complex geometries, 500-607 flows easily through even narrow passages and vias. It’s a ready-to-use, room temperature moisture cured silicone that cures to a tough, resilient rubber. When a non-corrosive product is required, this is an alternate unprimed adhesive solution that:

  • Delivers a more uniform bond
  • Encloses components to protect against moisture and dust
  • Helps dampen vibrations

500-607 is a low viscosity two-component silicone that, when mixed, cures to a moderately flexible elastomer. This material is shipped in separate containers that are labeled Part A and Part B. While the material may be mixed by hand, it is more appropriate to use automated, meter-mixing equipment.

    Product information:

    Novagard’s 500 series moisture-cure conformal coatings and sealants achieve primer-less adhesion to aluminum, polycarbonate, glass, and steel. The inside-out cure provides longer working times and low odor, and are free of solvents with no isocyanates.

    Certain materials, chemicals, curing agents, and plasticizers may inhibit the cure. The most notable are organotin catalysts, amino compounds, polysulfide, and other sulfur-containing materials. Do not use in or around highly oxidative chemicals such as liquid oxygen, chlorine, or peroxides. Not recommended for surfaces that are to be painted.

    Do not estimate weights and measures. Two part silicones are mix ratio sensitive and require accurate metering (1 part A : 1 part B v/v).


    • Frame and junction box sealant in photovoltaic modules
    • Sensitive electronic components and circuit boards
    • Potted sensors and wiring junctions
    • General industrial potting and bonding applications requiring a non- corrosive product

    Product documents: